Low capacitance chip offers ESD protection for USB3.0

By lowering the capacitance down to 0.4 pF typical, 0.5pF maximum, the ESD7004 offers an ESD protection solution that has virtually no effect on eye diagrams of USB 3.0 at 5Gbit/s and eSATA at 6Gbit/s,” said the company.

The devices also have less than 1db insertion loss at over 8GHz during S21 measurements, ensuring negligible effect on high speed data transmission. 
 
“The ESD7004 from ON Semiconductor addresses the needs of this trend by offering an ESD protection solution that protects sensitive chipsets without degrading the signal integrity of the high speed interfaces it is protecting,” said Gary Straker, vice president and general manager at ON Semiconductor.  
 
The ESD7004 is designed to offer low clamping voltages and fast response time during ESD events. These designs boast clamping voltages at 11.4V or less during Transmission Line Pulse (TLP) +/-8A testing which safeguards chipsets using small geometries and low voltage tolerances, common for high speed datalines.

An ESD rating of 15 kV contact per the IEC61000-4-2 standard and low turn on resistance during ESD events ensures that the most sensitive chipsets will be safe from ESD threats. 
 
This ESD7004 is offered in the uDFN 2.5 mm x 1.0 mm x 0.5 mm 10-pin package which integrates four lines of protection in a flow through routing pin-out.